- 专利标题： Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions
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申请号： US16182455申请日： 2018-11-06
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公开(公告)号： US11058007B2公开(公告)日： 2021-07-06
- 发明人: Marco Gavagnin , Markus Leitgeb , Alexander Kasper , Gernot Schulz
- 申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 申请人地址： AT Leoben
- 专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人地址： AT Leoben
- 代理机构： Smith Tempel Blaha LLC
- 代理商 Robert A. Blaha
- 优先权： EP17200200 20171106
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L21/48 ; H01L23/538 ; H05K1/02 ; H05K3/46
摘要：
A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.
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