- Patent Title: Ultrasonic device unit, ultrasonic probe, and ultrasonic apparatus
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Application No.: US15922128Application Date: 2018-03-15
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Publication No.: US11058395B2Publication Date: 2021-07-13
- Inventor: Kazuki Yoshida
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2017-055391 20170322
- Main IPC: A61B8/00
- IPC: A61B8/00 ; H05K1/18 ; B06B1/06 ; A61B8/06

Abstract:
An ultrasonic device unit includes an ultrasonic device including 1-st through n-th vibrator elements and 1-st through n-th device-side terminals connected corresponding respectively to the vibrator elements, and a flexible printed wiring board to be connected to the ultrasonic device, in which the flexible printed wiring board includes a first connector section provided with 1-st through k-th external connection terminals, a second connector section provided with (k+1)-th through n-th external connection terminals, a device connection section which is disposed between the first connector section and the second connector section, and to which the 1-st through n-th device-side terminals are connected, and interconnections adapted to connect the i-th device-side terminal and the i-th external connection terminal to each other.
Public/Granted literature
- US20180271489A1 ULTRASONIC DEVICE UNIT, ULTRASONIC PROBE, AND ULTRASONIC APPARATUS Public/Granted day:2018-09-27
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