- 专利标题： Thermal interface material system
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申请号： US14967087申请日： 2015-12-11
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公开(公告)号： US11060805B2公开(公告)日： 2021-07-13
- 发明人: Tadej Semenic , Kyle D. Gould , Avijit Bhunia
- 申请人： TELEDYNE SCIENTIFIC & IMAGING, LLC.
- 申请人地址： US CA Thousand Oaks
- 专利权人： TELEDYNE SCIENTIFIC & IMAGING, LLC.
- 当前专利权人： TELEDYNE SCIENTIFIC & IMAGING, LLC.
- 当前专利权人地址： US CA Thousand Oaks
- 代理机构： K&L Gates LLP
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; F28F21/08 ; F28F13/00 ; H01L23/42 ; F28F21/02
摘要：
A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.
公开/授权文献
- US20160169598A1 Thermal Interface Material System 公开/授权日：2016-06-16
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