A method of fabricating a substrate is provided. The method of fabricating the substrate includes forming a first conductive pattern; forming a first insulating layer, and forming a first blind hole in the first insulating layer; forming a conductive film layer, and removing at least a portion of the conductive film layer in the first blind hole; thinning a portion of the first insulating layer at a bottom of the first blind hole to form a second blind hole; forming an intermediate insulating layer, and forming a second via hole in the intermediate insulating layer; removing the portion of the first insulating layer and forming a first via hole in the first insulating pattern layer; and forming a second conductive pattern. The second conductive pattern directly contacts the first conductive pattern through the first via hole and the second via hole and insulates from the intermediate conductive pattern.