- 专利标题: Integrated assemblies comprising folded-digit-line-configurations
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申请号: US16835797申请日: 2020-03-31
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公开(公告)号: US11069385B1公开(公告)日: 2021-07-20
- 发明人: Jiyun Li , Scott J. Derner
- 申请人: Micron Technology, inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, inc.
- 当前专利权人: Micron Technology, inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: G11C11/24
- IPC分类号: G11C11/24 ; G11C7/08 ; G11C11/4091 ; H01L27/108
摘要:
Some embodiments include an integrated assembly having a second deck over a first deck. A first true digit line has first and second segments along the first deck. A first complementary digit line has third and fourth segments along the second deck. The first true digit line is comparatively compared to the first complementary digit line. A second true digit line has a third region along the first deck and a fourth region along the second deck. The third region is adjacent the first segment, and the fourth region is adjacent the third segment. A second complementary digit line has a fifth region along the first deck and has a sixth region along the second deck. The fifth region is adjacent the second segment, and the sixth region is adjacent the fourth segment. The second true digit line is comparatively compared to the second complementary digit line.
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