Mold tool and methods for airfoil bonding
Abstract:
An airfoil bonding system may comprise a mold tool configured to support an airfoil assembly during a bonding process. The bonding process may include applying heat and pressure to the airfoil assembly. A surface of the mold tool may complement a preselected airfoil parameter. The mold tool may maintain the airfoil assembly in the preselected airfoil parameter during the application of heat and pressure to the airfoil assembly.
Public/Granted literature
Information query
Patent Agency Ranking
0/0