Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US16371900Application Date: 2019-04-01
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Publication No.: US11075107B2Publication Date: 2021-07-27
- Inventor: Chun Hao Liao , Chu Fu Chen , Chun-Wei Hsu , Chia-Cheng Pao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/8234 ; H01L29/66 ; H01L27/088 ; H01L29/78 ; H01L29/06

Abstract:
The present disclosure provides a semiconductor structure, including a transistor. The transistor includes a semiconductive substrate, a gate structure, a pair of highly doped regions and a dielectric element. The semiconductive substrate has a top surface. The gate structure is over the top surface. The pair of highly doped regions is separated by the gate structure. The dielectric element is embedded in the semiconductive substrate. The dielectric element is laterally and vertically misaligned with the pair of highly doped regions.
Information query
IPC分类: