Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device structure. The die can be attached to a substrate along with another die that is attached to the substrate. An encapsulant can be between each die and the substrate and laterally between the dies.