Invention Grant
- Patent Title: Semiconductor package system
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Application No.: US16397278Application Date: 2019-04-29
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Publication No.: US11075138B2Publication Date: 2021-07-27
- Inventor: Heungkyu Kwon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0054304 20180511,KR10-2018-0054305 20180511,KR10-2018-0054307 20180511,KR10-2018-0055081 20180514,KR10-2018-0110511 20180914
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/31 ; H01L23/367 ; H01L23/00

Abstract:
Provided is a semiconductor package system. The system includes a substrate, a first semiconductor package on the substrate, a second semiconductor package on the substrate, a first passive element on the substrate, a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element, and a first heat conduction layer between the first semiconductor package and the heat dissipation structure. A sum of a height of the first semiconductor package and a thickness of the first heat conduction layer may be greater than a height of the first passive element. The height of the first semiconductor package may be greater than a height of the second semiconductor package.
Information query
IPC分类: