- 专利标题： Infrastructure equipment providing terrestrial coverage to terrestrial electronic devices and aerial coverage to aerial electronic devices
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申请号： US16643591申请日： 2018-07-26
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公开(公告)号： US11076329B2公开(公告)日： 2021-07-27
- 发明人: Shinichiro Tsuda , Hideji Wakabayashi
- 申请人： Sony Corporation
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Xsensus LLP
- 优先权： EP17189880 20170907
- 国际申请： PCT/EP2018/070357 WO 20180726
- 国际公布： WO2019/048127 WO 20190314
- 主分类号： H04W36/08
- IPC分类号： H04W36/08 ; H04W76/27 ; H04B7/06 ; H04L5/00 ; H04W36/30 ; H04W16/28 ; H04W24/10
摘要：
Infrastructure equipment comprising circuitry configured to provide a terrestrial cell coverage to a terrestrial UE and an aerial cell coverage to an aerial UE, the aerial cell coverage being provided in a tracking manner in relation to a mobility of the aerial UE.
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