Invention Grant
- Patent Title: Modular high-frequency source
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Application No.: US15958470Application Date: 2018-04-20
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Publication No.: US11081317B2Publication Date: 2021-08-03
- Inventor: Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03F3/19 ; H03F3/21

Abstract:
Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
Public/Granted literature
- US20190326095A1 MODULAR HIGH-FREQUENCY SOURCE Public/Granted day:2019-10-24
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