Invention Grant
- Patent Title: Packaging material for power storage device
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Application No.: US15834275Application Date: 2017-12-07
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Publication No.: US11081748B2Publication Date: 2021-08-03
- Inventor: Hiroshi Dai , Junya Imamoto , Yu Ogihara , Masayoshi Suzuta
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2015-117618 20150610,JPJP2015-173072 20150902
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B15/085 ; B32B15/20 ; H01G11/80 ; H01M50/116 ; H01G11/16 ; H01M50/124 ; H01M50/183

Abstract:
Packaging material for a power storage device, comprising at least a substrate layer, an adhesive layer, a metal foil layer and a sealant layer wherein the sealant layer contains an inorganic filler and an occupying ratio of the inorganic filler relative to the total thickness of the sealant layer is 5 to 50%, and also to a packaging material for a power storage device, comprising a substrate layer, a barrier layer and also to a packaging material for power storage device, which comprises a substrate layer, a barrier layer and a sealant layer arranged in this order wherein the barrier layer is made of a metal foil and has a corrosion inhibition treatment layer at least at a side of the sealant layer, and the sealant layer is formed directly on the corrosion inhibition layer, has a thickness of 5 to 30 μm, and contains a high melting point material.
Public/Granted literature
- US20180102514A1 PACKAGING MATERIAL FOR POWER STORAGE DEVICE Public/Granted day:2018-04-12
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