Invention Grant
- Patent Title: Heat-dissipating sheet
-
Application No.: US16481502Application Date: 2018-01-19
-
Publication No.: US11085712B2Publication Date: 2021-08-10
- Inventor: Shigeru Koyano , Yoshifumi Iimuro , Yoshiya Sakaguchi
- Applicant: SEKISUI POLYMATECH CO., LTD. , Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Saitama; JP Osaka
- Assignee: SEKISUI POLYMATECH CO., LTD.,Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: SEKISUI POLYMATECH CO., LTD.,Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Saitama; JP Osaka
- Agency: Buchanan, Ingersoll & Ronney PC
- Priority: JPJP2017-014789 20170130
- International Application: PCT/JP2018/001604 WO 20180119
- International Announcement: WO2018/139364 WO 20180208
- Main IPC: F28F21/02
- IPC: F28F21/02 ; F28F21/06 ; H01L23/29 ; H05K7/20

Abstract:
To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.
Public/Granted literature
- US20190390926A1 HEAT-DISSIPATING SHEET Public/Granted day:2019-12-26
Information query