Invention Grant
- Patent Title: Nickel lanthanide alloys for MEMS packaging applications
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Application No.: US16774529Application Date: 2020-01-28
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Publication No.: US11091366B2Publication Date: 2021-08-17
- Inventor: Nazila Dadvand , Kathryn Schuck
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L29/40 ; B81B7/00 ; B81C1/00 ; H01L23/00
Abstract:
A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
Public/Granted literature
- US20200165124A1 NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS Public/Granted day:2020-05-28
Information query
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