Invention Grant
- Patent Title: Assembly with enhanced insulation
-
Application No.: US16641362Application Date: 2018-08-22
-
Publication No.: US11091907B2Publication Date: 2021-08-17
- Inventor: Fabrice Chopard , Cedric Huillet
- Applicant: HUTCHINSON
- Applicant Address: FR Paris
- Assignee: HUTCHINSON
- Current Assignee: HUTCHINSON
- Current Assignee Address: FR Paris
- Agency: Lathrop GPM LLP
- Priority: FR1757791 20170822
- International Application: PCT/FR2018/052093 WO 20180822
- International Announcement: WO2019/038508 WO 20190228
- Main IPC: F16L59/065
- IPC: F16L59/065 ; E04B1/80

Abstract:
An assembly comprising at least one first pocket (3) which contains a thermally insulating material (5) and in which a first controlled atmosphere prevails, and at least one second pocket (7) which surrounds the first pocket and in which a second controlled atmosphere prevails.
The first controlled atmosphere is different from the second one and corresponds to a vacuum of 10 Pa or less. The thermally insulating material (5) preferably has open cells with a diameter greater than or equal to 1 micron.
The first controlled atmosphere is different from the second one and corresponds to a vacuum of 10 Pa or less. The thermally insulating material (5) preferably has open cells with a diameter greater than or equal to 1 micron.
Public/Granted literature
- US20200224412A1 ASSEMBLY WITH ENHANCED INSULATION Public/Granted day:2020-07-16
Information query