• Patent Title: Assembly with enhanced insulation
  • Application No.: US16641362
    Application Date: 2018-08-22
  • Publication No.: US11091907B2
    Publication Date: 2021-08-17
  • Inventor: Fabrice ChopardCedric Huillet
  • Applicant: HUTCHINSON
  • Applicant Address: FR Paris
  • Assignee: HUTCHINSON
  • Current Assignee: HUTCHINSON
  • Current Assignee Address: FR Paris
  • Agency: Lathrop GPM LLP
  • Priority: FR1757791 20170822
  • International Application: PCT/FR2018/052093 WO 20180822
  • International Announcement: WO2019/038508 WO 20190228
  • Main IPC: F16L59/065
  • IPC: F16L59/065 E04B1/80
Assembly with enhanced insulation
Abstract:
An assembly comprising at least one first pocket (3) which contains a thermally insulating material (5) and in which a first controlled atmosphere prevails, and at least one second pocket (7) which surrounds the first pocket and in which a second controlled atmosphere prevails.
The first controlled atmosphere is different from the second one and corresponds to a vacuum of 10 Pa or less. The thermally insulating material (5) preferably has open cells with a diameter greater than or equal to 1 micron.
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