Invention Grant
- Patent Title: Electronic component with external electrodes including conductive resin layer
-
Application No.: US16250609Application Date: 2019-01-17
-
Publication No.: US11094465B2Publication Date: 2021-08-17
- Inventor: Shinya Onodera , Takehisa Tamura , Ken Morita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-015113 20180131
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/005 ; H01G4/248 ; H01G4/12

Abstract:
An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.
Public/Granted literature
- US20190237259A1 ELECTRONIC COMPONENT Public/Granted day:2019-08-01
Information query