The TFT array substrate has a third conductive layer connected to a first conductive layer and a second conductive layer through a first via and a second via, respectively. The third conductive layer further has separated first and second openings. The first opening has a vertical projection to a side of the second via and has an end extending beyond an edge of the second via adjacent to the first via. The second opening has a vertical projection to a side of the first via and has an end extending beyond an edge of the first via adjacent to the second via. As such, when the third conductive layer is stricken by static electricity, the first and second openings prevent a crack from breaking the first and second conductive layers apart, thereby enhancing the reliability of the connection between the first and second conductive layers.