- 专利标题: Thin film transistor and manufacturing method thereof, array substrate and display device
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申请号: US15780166申请日: 2017-09-30
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公开(公告)号: US11094799B2公开(公告)日: 2021-08-17
- 发明人: Bingqiang Gui , Lianjie Qu , Yonglian Qi , Hebin Zhao
- 申请人: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- 申请人地址: CN Beijing; CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- 当前专利权人地址: CN Beijing; CN Beijing
- 代理机构: McDermott Will and Emery LLP
- 优先权: CN201710204453.X 20170329
- 国际申请: PCT/CN2017/104881 WO 20170930
- 国际公布: WO2018/176784 WO 20181004
- 主分类号: H01L21/44
- IPC分类号: H01L21/44 ; H01L29/40 ; H01L29/66 ; H01L29/417 ; H01L29/786 ; H01L29/16 ; H01L29/45
摘要:
A thin film transistor includes: a bottom gate electrode; a bottom gate electrode insulating layer, a semiconducting active layer and a first insulating layer which are disposed on the bottom gate electrode in sequence; a source electrode and a drain electrode which are disposed at a side of the first insulating layer away from the bottom gate electrode; vias disposed in the first insulating layer at positions which correspond to the source electrode and the drain electrode respectively; and ohmic contact layers disposed on and covering the semiconducting active layer at positions corresponding to the vias respectively. Each of the source electrode and the drain electrode is in contact with a corresponding one of the ohmic contact layers through a corresponding one of the vias.
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