An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.