Invention Grant
- Patent Title: Selective laser solidification apparatus and method
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Application No.: US16838095Application Date: 2020-04-02
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Publication No.: US11104121B2Publication Date: 2021-08-31
- Inventor: Ben Ian Ferrar
- Applicant: RENISHAW PLC
- Applicant Address: GB Wotton-under-Edge
- Assignee: RENISHAW PLC
- Current Assignee: RENISHAW PLC
- Current Assignee Address: GB Wotton-under-Edge
- Agency: Oliff PLC
- Main IPC: B22F10/322
- IPC: B22F10/322 ; B33Y50/02 ; B33Y10/00 ; B33Y30/00 ; B29C64/153 ; B29C64/268 ; B29C64/364 ; B29C64/20 ; B22F10/20 ; B23K26/342 ; B22F3/10 ; B29C64/386 ; B22F10/30 ; B22F10/28 ; B22F10/32 ; B22F10/00

Abstract:
A method of selecting a scanning sequence of a laser beam in a selective laser solidification process, in which one or more objects are formed layer-by-layer by repeatedly depositing a layer of powder on a powder bed and scanning the laser beam over the deposited powder to selectively solidify at least part of the powder layers, includes determining an order in which areas should be scanned by: projecting a debris fallout zone that would be created when solidifying each area based on a gas flow direction of a gas flow passed over the powder bed; determining whether one or more other areas to be solidified fall within the debris fallout zone; and selecting to solidify the one or more other areas that fall within the debris fallout zone before solidifying the area from which the debris fallout zone has been projected.
Public/Granted literature
- US20200230944A1 SELECTIVE LASER SOLIDIFICATION APPARATUS AND METHOD Public/Granted day:2020-07-23
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