Invention Grant
- Patent Title: Optimized shipment transfer
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Application No.: US17068819Application Date: 2020-10-12
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Publication No.: US11111076B1Publication Date: 2021-09-07
- Inventor: Stephen T. Campbell , Robert M Whitten , Shilpi Gupta , Ibolya Horvath , Oksana Mikhailovna Kharchenko , Justina Lakinger , Ryan Clarke
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lee & Hayes, P.C.
- Main IPC: B65G1/06
- IPC: B65G1/06 ; B65G67/08 ; B65G67/24

Abstract:
With respect to a transfer facility configured to optimize package transfers therethrough, a container housing packages may be delivered to a first floor of the transfer facility. The packages may be transported to consolidation stations based on destinations associated therewith. In some examples, the packages may be bound for a single destination and thus transported to a single consolidation station. In some examples, the packages may be bound for multiple destinations and thus transported to a second floor of the transfer facility for sortation. A destination and mode of transportation associated with the package may be determined at an induction station on the second floor, as well as a consolidation station associated therewith. A drive unit may insert the package into a chute for transit down a slide to the consolidation station, where it may be placed into another container for shipment to the destination via the mode of transportation.
Information query
IPC分类: