Invention Grant
- Patent Title: Back-illuminated sensor and a method of manufacturing a sensor
-
Application No.: US16421212Application Date: 2019-05-23
-
Publication No.: US11114489B2Publication Date: 2021-09-07
- Inventor: Yung-Ho Alex Chuang , Jingjing Zhang , John Fielden , David L. Brown , Masaharu Muramatsu , Yasuhito Yoneta , Shinya Otsuka
- Applicant: KLA-Tencor Corporation , Hamamatsu Photonics K.K.
- Applicant Address: US CA Milpitas; JP Hamamatsu
- Assignee: KLA-Tencor Corporation,Hamamatsu Photonics K.K.
- Current Assignee: KLA-Tencor Corporation,Hamamatsu Photonics K.K.
- Current Assignee Address: US CA Milpitas; JP Hamamatsu
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor for electrons or short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. The circuit elements are connected by metal interconnects comprising a refractory metal. An anti-reflection or protective layer may be formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.
Public/Granted literature
- US20190386054A1 Back-Illuminated Sensor And A Method Of Manufacturing A Sensor Public/Granted day:2019-12-19
Information query
IPC分类: