Invention Grant
- Patent Title: Integrated circuit including multiple height cell and method of fabricating the integrated circuit
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Application No.: US16292433Application Date: 2019-03-05
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Publication No.: US11121155B2Publication Date: 2021-09-14
- Inventor: Jung-ho Do , Ji-su Yu , Hyeon-gyu You , Seung-young Lee , Jae-boong Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2018-0057324 20180518
- Main IPC: H01L27/118
- IPC: H01L27/118 ; H01L23/52 ; H01L21/82 ; H01L27/02 ; G06F30/39
Abstract:
An integrated circuit includes a first cell arranged in a first row extending in a first horizontal direction, a second cell arranged in a second row adjacent to the first row, and a third cell continuously arranged in the first row and the second row. The first cell and the second cell comprise respective portions of a first power line extending in the first horizontal direction, and the third cell includes a second power line electrically connected to the first power line and extending in the first horizontal direction in the first row.
Public/Granted literature
- US20190355749A1 INTEGRATED CIRCUIT INCLUDING MULTIPLE HEIGHT CELL AND METHOD OF FABRICATING THE INTEGRATED CIRCUIT Public/Granted day:2019-11-21
Information query
IPC分类:
