Invention Grant
- Patent Title: Printed circuit board and package having the same
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Application No.: US16676493Application Date: 2019-11-07
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Publication No.: US11122694B2Publication Date: 2021-09-14
- Inventor: Tae-Hong Min , Ju-Ho Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0154656 20181204
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K1/14 ; H05K1/18 ; H05K3/00 ; H05K3/22 ; H05K3/32 ; H05K3/40 ; H05K3/46 ; G06K19/077
Abstract:
A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
Public/Granted literature
- US20200178401A1 PRINTED CIRCUIT BOARD AND PACKAGE HAVING THE SAME Public/Granted day:2020-06-04
Information query
