Invention Grant
- Patent Title: Boas arrangement with double dovetail attachments
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Application No.: US16675881Application Date: 2019-11-06
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Publication No.: US11125099B2Publication Date: 2021-09-21
- Inventor: Carson A. Roy Thill , Andrew D. Keene , Danielle Mahoney , Jaime A. Arbona , Justin K. Bleil
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: F01D11/08
- IPC: F01D11/08 ; F01D25/24

Abstract:
A flow path component assembly includes a support structure. A flow path component has a plurality of segments that are arranged circumferentially about an axis and are mounted in the support structure by a carrier. At least one of the segments have a first wall axially spaced from a second wall. The first wall has first and second hooks spaced apart from one another in a circumferential direction. The second wall has third and fourth hooks spaced apart from one another in the circumferential direction. The first, second, third, and fourth hooks are in engagement with the carrier.
Public/Granted literature
- US20210131301A1 BOAS ARRANGEMENT WITH DOUBLE DOVETAIL ATTACHMENTS Public/Granted day:2021-05-06
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