A method for removing a material from a surface of a substrate includes impinging a laser beam on the material during a first sweep to remove the material from the surface along a first line and impinging the laser beam on the material during a second sweep to remove the material from the surface along a second line adjacent to the first line. The first line includes first artifacts that form a first portion of an array of artifacts on the surface. The second line includes second artifacts that form a second portion of the array of artifacts on the surface. A first laser pulse of the laser beam corresponding with the second sweep is synchronized with a start of the second sweep when transitioning between the first line and the second line such that the start of the second sweep coincides with the first laser pulse.