- 专利标题: Unified material-to-systems simulation, design, and verification for semiconductor design and manufacturing
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申请号: US16781980申请日: 2020-02-04
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公开(公告)号: US11126769B2公开(公告)日: 2021-09-21
- 发明人: Bhuvaneshwari Ayyagari , Angada Bangalore Sachid
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: G06F30/3308
- IPC分类号: G06F30/3308 ; G06F30/20
摘要:
A complete, unified material-to-systems simulation, design, and verification method for semiconductor design and manufacturing may include evaluating effects of semiconductor material or process changes on software algorithms. The method may include translating the material or process change into a database of characteristics; generating primitive circuit structures using the database of characteristics; performing an electrical characterization of the primitive circuit structures; providing an output of the electrical characterization to a script to generate compact models; generating a lite version of standard cells; generating a digital system based on the lite version of the standard cells; and evaluating a performance of a software algorithm on the digital system to determine an effect of the material or process change for the semiconductor manufacturing process.
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