发明授权
- 专利标题: Coil component
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申请号: US16059626申请日: 2018-08-09
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公开(公告)号: US11127517B2公开(公告)日: 2021-09-21
- 发明人: Soon Kwang Kwon , Joong Won Park , Young Seuck Yoo
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2017-0180630 20171227
- 主分类号: H01F3/14
- IPC分类号: H01F3/14 ; H01F27/30 ; H01B3/40 ; H01F27/26 ; H01F27/255 ; H01F1/153 ; H01F1/147
摘要:
A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
公开/授权文献
- US20190198211A1 COIL COMPONENT 公开/授权日:2019-06-27
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