Invention Grant
- Patent Title: Coil component
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Application No.: US16059626Application Date: 2018-08-09
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Publication No.: US11127517B2Publication Date: 2021-09-21
- Inventor: Soon Kwang Kwon , Joong Won Park , Young Seuck Yoo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0180630 20171227
- Main IPC: H01F3/14
- IPC: H01F3/14 ; H01F27/30 ; H01B3/40 ; H01F27/26 ; H01F27/255 ; H01F1/153 ; H01F1/147

Abstract:
A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
Public/Granted literature
- US20190198211A1 COIL COMPONENT Public/Granted day:2019-06-27
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