Invention Grant
- Patent Title: Method for fabricating magnetic core
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Application No.: US16665894Application Date: 2019-10-28
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Publication No.: US11133374B2Publication Date: 2021-09-28
- Inventor: Yen-Shuo Su , Chun-Tsung Kuo , Jiech-Fun Lu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01F17/00 ; H01F41/04
Abstract:
A method includes depositing a magnetic layer over a dielectric layer, and etching a first portion of the magnetic layer, in which a second portion of the magnetic layer that is directly under the first portion of the magnetic layer remains over the dielectric layer after etching the first portion of the magnetic layer. The second portion of the magnetic layer is etched.
Public/Granted literature
- US20200066832A1 METHOD FOR FABRICATING MAGNETIC CORE Public/Granted day:2020-02-27
Information query
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