Invention Grant
- Patent Title: Diamine compound, and polyimide compound and molded product using the same
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Application No.: US16868657Application Date: 2020-05-07
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Publication No.: US11136286B2Publication Date: 2021-10-05
- Inventor: Toshiyuki Goshima , Win Maw Soe
- Applicant: WINGO TECHNOLOGY CO., LTD.
- Applicant Address: JP Okayama
- Assignee: WINGO TECHNOLOGY CO., LTD.
- Current Assignee: WINGO TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Okayama
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2017-013567 20170127,JP2017-013580 20170127,JP2017-226242 20171124,JP2017-226250 20171124
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C07C229/60 ; C07C201/12 ; C07C227/04 ; C08G69/26 ; C08G73/16

Abstract:
[Problems to be solved] The present invention provides a novel diamine compound which allows for the synthesis of a polyimide compound having a high solubility in an organic solvent and a high melt moldability.
[Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1): (wherein R1 to R8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R1 to R8 is a substituted or unsubstituted aromatic group).
[Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1): (wherein R1 to R8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R1 to R8 is a substituted or unsubstituted aromatic group).
Public/Granted literature
- US20200262782A1 Diamine Compound, and Polyimide Compound and Molded Product Using the Same Public/Granted day:2020-08-20
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