Invention Grant
- Patent Title: Electronic component
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Application No.: US15892784Application Date: 2018-02-09
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Publication No.: US11139112B2Publication Date: 2021-10-05
- Inventor: Yuya Ishima , Yasushi Matsuyama , Yuto Shiga , Shunji Aoki , Shinichi Kondo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-031175 20170222
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F41/04 ; H01F27/32 ; H01F27/28 ; H01F27/29 ; H01F17/00

Abstract:
An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.
Public/Granted literature
- US20180240591A1 ELECTRONIC COMPONENT Public/Granted day:2018-08-23
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