Invention Grant
- Patent Title: Induction heating device having improved component arrangement structure and assemblability
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Application No.: US16687935Application Date: 2019-11-19
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Publication No.: US11140753B2Publication Date: 2021-10-05
- Inventor: Seongjun Kim , Seongho Son , Yongsoo Lee
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2018-0143014 20181119
- Main IPC: H05B6/12
- IPC: H05B6/12 ; F21V8/00

Abstract:
An induction heating device includes: a case; working coils; a base plate that supports the working coils; light guides that are installed on the base plate and that cover outer portions of each working coil; light emitting elements disposed below the light guides and configured to emit light; and an indicator substrate that is disposed below the base plate and that seats the light emitting elements. The indicator substrate includes a first indicator substrate, where a first portion of the light emitting elements are arranged along outer portions of the first indicator substrate, and a second indicator substrate disposed at a rear side of the first indicator substrate, where a second portion of the light emitting elements are arranged along outer portions of the second indicator substrate except for an outer portion at a front side that is adjacent to and faces the rear side of the first indicator substrate.
Public/Granted literature
- US20200163170A1 INDUCTION HEATING DEVICE HAVING IMPROVED COMPONENT ARRANGEMENT STRUCTURE AND ASSEMBLABILITY Public/Granted day:2020-05-21
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