- 专利标题: Printed circuit board including warpage offset regions and semiconductor packages including the same
-
申请号: US16689403申请日: 2019-11-20
-
公开(公告)号: US11140772B2公开(公告)日: 2021-10-05
- 发明人: Shle-Ge Lee , Youngbae Kim
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Sughrue Mion, PLLC
- 优先权: KR10-2017-0138563 20171024
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H01L25/065 ; H01L23/498 ; H01L23/00 ; H01L23/31
摘要:
A printed circuit board can include a base layer, a first surface and a second surface opposite to each other. A first routing layer can be on the first surface and a second routing layer can be on the second surface, the first routing layer can be provided at an upper part of each of the first and second regions and the second routing layer can be provided at a lower part of each of the first and second regions. The upper part of the first region can have a first line-area ratio, the upper part of the second region can have a second line-area ratio, the lower part of the first region can have a third line-area ratio, the lower part of the second region can have a fourth line-area ratio, the second and third line-area ratios can be greater than each of the first and fourth line-area ratios.
公开/授权文献
信息查询