Invention Grant
- Patent Title: Shutter assemblies for electronic devices
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Application No.: US16481509Application Date: 2017-12-15
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Publication No.: US11143937B2Publication Date: 2021-10-12
- Inventor: Ya-Ting Yeh , Kuan-Ting Wu , Shih-Hsun Huang
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2017/066614 WO 20171215
- International Announcement: WO2019/117938 WO 20190620
- Main IPC: G03B11/04
- IPC: G03B11/04 ; G03B9/08 ; H04N5/225 ; G06F1/16 ; G03B9/58
Abstract:
Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.
Public/Granted literature
- US20210286234A1 SHUTTER ASSEMBLIES FOR ELECTRONIC DEVICES Public/Granted day:2021-09-16
Information query
