Invention Grant
- Patent Title: Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member
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Application No.: US16349340Application Date: 2017-11-08
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Publication No.: US11147156B2Publication Date: 2021-10-12
- Inventor: Isao Iwayama , Shigeki Koyama , Masashi Okamoto , Yuta Inoue , Hiroyuki Kontani , Takehisa Yamamoto
- Applicant: Sumitomo Electric Industries, Ltd. , A.L.M.T. Corp.
- Applicant Address: JP Osaka; JP Tokyo
- Assignee: Sumitomo Electric Industries, Ltd.,A.L.M.T. Corp.
- Current Assignee: Sumitomo Electric Industries, Ltd.,A.L.M.T. Corp.
- Current Assignee Address: JP Osaka; JP Tokyo
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2016-236959 20161206
- International Application: PCT/JP2017/040324 WO 20171108
- International Announcement: WO2018/105297 WO 20180614
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/373 ; H05K1/18 ; H05K1/03 ; C22C29/06 ; H05K7/20 ; C22C26/00

Abstract:
A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 μm, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.
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