Invention Grant
- Patent Title: Flexible substrate, electronic device, and method for manufacturing electronic device
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Application No.: US16962171Application Date: 2018-12-25
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Publication No.: US11147162B2Publication Date: 2021-10-12
- Inventor: Mayumi Uno , Kazuki Maeda , Masashi Nitani , Busang Cha , Junichi Takeya
- Applicant: PI-CRYSTAL INCORPORATION , OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP Kashiwa; JP Izumi
- Assignee: PI-CRYSTAL INCORPORATION,OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: PI-CRYSTAL INCORPORATION,OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Kashiwa; JP Izumi
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2018-004502 20180115
- International Application: PCT/JP2018/047444 WO 20181225
- International Announcement: WO2019/138855 WO 20190718
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/09 ; H05K1/14 ; H05K3/12 ; H05K3/36 ; B29L31/34

Abstract:
A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
Public/Granted literature
- US11178764B2 Flexible substrate, electronic device, and method for manufacturing electronic device Public/Granted day:2021-11-16
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