Invention Grant
- Patent Title: Protected interconnect for solid state camera module
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Application No.: US16324260Application Date: 2017-08-09
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Publication No.: US11150438B2Publication Date: 2021-10-19
- Inventor: Ya Wen Hsu , Pierre-Jean Y. Parodi-Keravec , Steven Webster
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Robert C. Kowert
- International Application: PCT/US2017/046131 WO 20170809
- International Announcement: WO2018/031677 WO 20180215
- Main IPC: G02B7/02
- IPC: G02B7/02 ; G02B7/09 ; H04N5/225 ; G02B7/04

Abstract:
A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.
Public/Granted literature
- US20190179107A1 PROTECTED INTERCONNECT FOR SOLID STATE CAMERA MODULE Public/Granted day:2019-06-13
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |