Invention Grant
- Patent Title: Coil component
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Application No.: US16178452Application Date: 2018-11-01
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Publication No.: US11152147B2Publication Date: 2021-10-19
- Inventor: Tai Yon Cho , Chang Hak Choi , Byeong Cheol Moon , Sang Jong Lee , Hee Soo Yoon , Tae Jun Choi , Seung Hee Oh , Su Bong Jang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0021345 20180222,KR10-2018-0060196 20180528
- Main IPC: H01F27/36
- IPC: H01F27/36 ; H01F27/28 ; H01F41/04 ; H01F27/29 ; H01F17/00

Abstract:
A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.
Public/Granted literature
- US20190259529A1 COIL COMPONENT Public/Granted day:2019-08-22
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