- 专利标题： Micro-connection structure and manufacturing method thereof
-
申请号： US16871032申请日： 2020-05-10
-
公开(公告)号： US11152319B2公开(公告)日： 2021-10-19
- 发明人: Wen-Hsiung Lu , Chen-Shien Chen , Chen-En Yen , Cheng-Jen Lin , Chin-Wei Kang , Kai-Jun Zhan
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/00
摘要：
A micro-connection structure is provided. The micro-connection structure includes an under bump metallurgy (UBM) pad, a bump and an insulating ring. The UBM pad is electrically connected to at least one metallic contact of a substrate. The bump is disposed on the UBM pad and electrically connected with the UBM pad. The insulating ring surrounds the bump and the UBM pad. The bump is separate from the insulating ring with a distance and the bump is isolated by a gap between the insulating ring and the bump.
公开/授权文献
信息查询
IPC分类:
