Invention Grant
- Patent Title: Electronic package and method for fabricating the same
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Application No.: US16673078Application Date: 2019-11-04
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Publication No.: US11152331B2Publication Date: 2021-10-19
- Inventor: Lung-Yuan Wang , Feng Kao , Mao-Hua Yeh
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW108119514 20190605
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/552 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L25/16 ; H01L25/00 ; H01L23/31
Abstract:
An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
Information query
IPC分类:
