Invention Grant
- Patent Title: Rotatable service assembly for fluid ejection die
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Application No.: US16630049Application Date: 2017-09-14
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Publication No.: US11155094B2Publication Date: 2021-10-26
- Inventor: Si-lam Choy
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2017/051585 WO 20170914
- International Announcement: WO2019/055018 WO 20190321
- Main IPC: B41J2/165
- IPC: B41J2/165
Abstract:
A fluid ejection device includes a fluid ejection assembly including a fluid ejection die, and a service assembly to be rotated to different positions relative to the fluid ejection assembly for different service operations of the fluid ejection die.
Public/Granted literature
- US20200207095A1 ROTATABLE SERVICE ASSEMBLY FOR FLUID EJECTION DIE Public/Granted day:2020-07-02
Information query
IPC分类:
