Invention Grant
- Patent Title: Inductive sensor assembly for fluid measurements
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Application No.: US16276690Application Date: 2019-02-15
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Publication No.: US11156491B2Publication Date: 2021-10-26
- Inventor: Yiyang Liew , Earl Daniel Swope , Christopher Couch , Lucian Iordache , Tobias Becker , Kiranpal Singh , Mathias Michael , Oliver Schaaf
- Applicant: TE CONNECTIVITY CORPORATION , Tyco Electronics Canada ULC , TE CONNECTIVITY GERMANY GmbH , TE CONNECTIVITY INDIA PRIVATE LIMITED , Tyco Electronics NZ Limited
- Applicant Address: US PA Berwyn; CA Markham; DE Bensheim; IN Bangalore; NZ Auckland
- Assignee: TE CONNECTIVITY CORPORATION,Tyco Electronics Canada ULC,TE CONNECTIVITY GERMANY GmbH,TE CONNECTIVITY INDIA PRIVATE LIMITED,Tyco Electronics NZ Limited
- Current Assignee: TE CONNECTIVITY CORPORATION,Tyco Electronics Canada ULC,TE CONNECTIVITY GERMANY GmbH,TE CONNECTIVITY INDIA PRIVATE LIMITED,Tyco Electronics NZ Limited
- Current Assignee Address: US PA Berwyn; CA Markham; DE Bensheim; IN Bangalore; NZ Auckland
- Priority: IN201911002105 20190117
- Main IPC: G01F23/68
- IPC: G01F23/68 ; G01F23/26 ; F01M11/12 ; H05K1/18

Abstract:
A sensor assembly that includes a sealed housing. A printed circuit board assembly including a first section that includes processing circuitry is disposed within the sealed housing and a second section that includes detection circuitry extends from the sealed housing. The sensor assembly also includes a conductive target movably coupled to the second section of the printed circuit board to vary net voltage of the detection circuitry as the conductive target moves along the second section to provide an output signal. The processing circuitry detects the output signal and converts the output signal into a linear representation of position of the conductive target in relation to the second section.
Public/Granted literature
- US20200232834A1 INDUCTIVE SENSOR ASSEMBLY FOR FLUID MEASUREMENTS Public/Granted day:2020-07-23
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