Invention Grant
- Patent Title: Solid-state imaging element and solid-state imaging apparatus
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Application No.: US16316999Application Date: 2017-07-20
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Publication No.: US11158675B2Publication Date: 2021-10-26
- Inventor: Yohei Hirose , Iwao Yagi , Shintarou Hirata , Hideaki Mogi , Masashi Bando , Osamu Enoki
- Applicant: SONY CORPORATION , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Tokyo; JP Kanagawa
- Assignee: SONY CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY CORPORATION,SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Tokyo; JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2016-142154 20160720,JPJP2016-155728 20160808
- International Application: PCT/JP2017/026243 WO 20170720
- International Announcement: WO2018/016570 WO 20180125
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L27/30 ; H01L51/42 ; H01L51/44 ; H04N5/369

Abstract:
A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and an—upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.
Public/Granted literature
- US20190319071A1 SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS Public/Granted day:2019-10-17
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