Invention Grant
- Patent Title: Method of manufacturing a semiconductor device with multilayered channel structure
-
Application No.: US16939522Application Date: 2020-07-27
-
Publication No.: US11158742B2Publication Date: 2021-10-26
- Inventor: Chao-Ching Cheng , Chih Chieh Yeh , Cheng-Hsien Wu , Hung-Li Chiang , Jung-Piao Chiu , Tzu-Chiang Chen , Tsung-Lin Lee , Yu-Lin Yang , I-Sheng Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L21/8238 ; H01L21/8234 ; H01L29/10 ; H01L29/165

Abstract:
A semiconductor device includes a fin field effect transistor (FinFET). The FinFET includes a channel disposed on a fin, a gate disposed over the channel and a source and drain. The channel includes at least two pairs of a first semiconductor layer and a second semiconductor layer formed on the first semiconductor layer. The first semiconductor layer has a different lattice constant than the second semiconductor layer. A thickness of the first semiconductor layer is three to ten times a thickness of the second semiconductor layer at least in one pair.
Information query
IPC分类: