Invention Grant
- Patent Title: Flex integrated antenna array
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Application No.: US16132385Application Date: 2018-09-15
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Publication No.: US11165136B2Publication Date: 2021-11-02
- Inventor: Yu-Chin Ou , Mohammad Ali Tassoudji
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/04 ; H01Q21/06 ; H05K1/18 ; H05K1/02 ; H01L23/66 ; H01L23/498

Abstract:
Techniques are discussed herein for improving the form factor of a wideband antenna in a mobile device. An example of a wireless device according to the disclosure includes at least one radio frequency integrated circuit, a flex cable assembly operably coupled to the at least one radio frequency integrated circuit, and at least one radiator operably coupled to the flex cable assembly via at least one conductor in a ball grid array.
Public/Granted literature
- US20200091581A1 FLEX INTEGRATED ANTENNA ARRAY Public/Granted day:2020-03-19
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