A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.