Invention Grant
- Patent Title: Nano-electromechanical system (NEMS) device structure and method for forming the same
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Application No.: US16895446Application Date: 2020-06-08
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Publication No.: US11167984B2Publication Date: 2021-11-09
- Inventor: Hsin-Ping Chen , Carlos H. Diaz , Ken-Ichi Goto , Shau-Lin Shue , Tai-I Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H04R23/00
- IPC: H04R23/00 ; B82B1/00 ; B81C1/00 ; B81B3/00 ; B82B3/00

Abstract:
A NEMS device structure and a method for forming the same are provided. The NEMS device structure includes a first dielectric layer formed over a substrate, and a first conductive layer formed in the first dielectric layer. The NEMS device structure includes a second dielectric layer formed over the first dielectric layer, and a first supporting electrode a second supporting electrode and a beam structure formed in the second dielectric layer. The beam structure is formed between the first supporting electrode and the second supporting electrode, and the beam structure has a T-shaped structure. The NEMS device structure includes a first through hole formed between the first supporting electrode and the beam structure, and a second through hole formed between the second supporting electrode and the beam structure.
Public/Granted literature
- US20200299129A1 NANO-ELECTROMECHANICAL SYSTEM (NEMS) DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-09-24
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