Invention Grant
- Patent Title: Die matrix expander with partitioned subring
-
Application No.: US16041888Application Date: 2018-07-23
-
Publication No.: US11171031B2Publication Date: 2021-11-09
- Inventor: Matthew John Sherbin , Michael Todd Wyant , Dave Charles Stepniak , Hiroyuki Sada , Shoichi Iriguchi , Genki Yano
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B28D5/00 ; H01L21/78 ; H01L21/687
Abstract:
A die matrix expander includes a subring including ≥3 pieces, and a wafer frame supporting a dicing tape having an indentation for receiving pieces of the subring. The subring prior to expansion sits below a level of the wafer frame and has an outer diameter
Public/Granted literature
- US20200027772A1 DIE MATRIX EXPANDER WITH PARTITIONED SUBRING Public/Granted day:2020-01-23
Information query
IPC分类:
