Invention Grant
- Patent Title: Hermetic fully-filled metallized through-hole vias
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Application No.: US16744776Application Date: 2020-01-16
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Publication No.: US11171094B2Publication Date: 2021-11-09
- Inventor: Prantik Mazumder , Chukwudi Azubuike Okoro , Ah-Young Park , Scott Christopher Pollard , Navaneetha Krishnan Subbaiyan
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent Amy T. Lang; John P. McGroarty
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/15 ; H01L21/48 ; H01L23/498

Abstract:
According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 micron 1 / 2 .
Public/Granted literature
- US20200251424A1 HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS Public/Granted day:2020-08-06
Information query
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